Qualcomm has developed three new advanced 3G chips supporting high data speeds and high-end features. Among them there is one for HSPA+, one for EV-DO Rev. B, and one that combines HSPA+ and EV-DO Rev. B compatibility onto a single chipset. They all measure 12 x 12 mm and are backward compatible with previous generation technologies. Other supported features include ARM11 CPUs, Bluetooth 2.1+EDR, FM radios and GPS, 5Mpix cameras and TV-out, Windows Mobile and Linux OS, and accelerated graphics. All three chips will be brought into production in Q4 2008.
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