Qualcomm has successfully completed the world's first data call via HSPA+ network. Data throughput exceeded 20Mbps using a 5MHz band of the spectrum.
HSPA+ is backwardly compatible with current UMTS, HSDPA, and HSUPA devices, has a theoretical maximum bandwidth of 42Mbps for the downlink and 22Mbps for the uplink, and will double the data capacity of the current HSPA network while trippling the voice capacity. According to Qualcomm, it also provides "higher peak and average data rates, lower latency, better response times, longer battery life and an enhanced, always-on experience."
Qualcomm's MDM8200 HSPA+ chipset is now available to handset manufacturers.