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27 Dec 2008

Mobinnova ICE high-end smartphone

Mobinnova ICE high-end smartphone

Taiwanese manufacturer Mobinnova, the new partner of Sony Ericsson in producing the next XPERIA, unveiled the Mobinnova ICE, its new flagship smartphone. And you know what, we already love it! Just look at the specs below:Specifications:

  • Dimensions: 114 x 53.5 x 13mm;
  • Weight: 120g with battery;
  • Networks: GSM850/900/1800/1900MHz & WCDMA/HSPA 900/1900/2100MHz HSDPA 7.

[Continue reading Mobinnova ICE high-end smartphone]

 

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